Samsung is gearing up for the launch of two exciting foldables next year: the Galaxy Z Flip FE and the Galaxy Z Flip7. According to recent leaks and industry insiders, these devices will come with significant chipset upgrades, adding more value to Samsung’s foldable lineup.
The Galaxy Z Flip FE, expected to be a more affordable version of the flagship Z Flip, will reportedly feature the Exynos 2400e chipset. This move marks a shift towards cost-cutting measures aimed at making foldables accessible to a broader audience without compromising essential performance. The Exynos 2400e has already proven itself in the Galaxy S24 FE, making it a solid choice for everyday tasks while keeping the cost down for consumers.
On the other hand, the Galaxy Z Flip7 is set to receive the Exynos 2500, an upcoming powerhouse that signals Samsung’s commitment to bringing its best-in-class in-house Exynos chips to the foldable segment. This move aligns with reports suggesting that the Snapdragon 8 Elite chipset will power the upcoming Galaxy S25 lineup, thus leaving the flagship Exynos 2500 for the foldable phones.
The shift from Qualcomm Snapdragon 8 Gen 3 in the Galaxy Z Flip6 to Exynos 2500 in the Z Flip7 highlights Samsung’s evolving strategy of balancing performance and cost-efficiency across different models. While the Z Flip FE targets budget-conscious buyers, the Z Flip7 will cater to those seeking top-tier performance in the foldable category.
As foldable phones continue to gain popularity, Samsung is positioning itself as a major player in the market with devices that provide premium features at various price points. The Exynos 2400e and Exynos 2500 chips are expected to offer seamless performance for multitasking, gaming, and content consumption, enhancing the overall foldable experience.
Stay tuned as more rumors and specs surface, with both devices expected to launch in the coming months. Will the Galaxy Z Flip FE and Z Flip7 redefine the future of foldable phones? Only time will tell.
