MediaTek, the leading Taiwanese semiconductor company, has officially announced the launch of its next-generation Dimensity chipsets. The event is scheduled to take place on December 23, 2024, at 3:00 PM CST (12:00 PM IST) in China. Although the brand has not disclosed the names of the new chipsets, industry speculation strongly points to the debut of the highly anticipated Dimensity 8400 SoC, a successor to last year’s Dimensity 8300 SoC.
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Expected Features and Specifications of Dimensity 8400 SoC
The MediaTek Dimensity 8400 SoC is expected to be an octa-core processor built on TSMC’s advanced 4nm technology. It is rumored to feature a 1+3+4 architecture, with:
- 1 Prime core clocked at 3.25GHz
- 3 Performance cores capped at 3.0GHz
- 4 Efficiency cores running at 2.1GHz
The chipset is likely to include the Immortalis-G720 MC7 GPU, designed for enhanced gaming and graphics performance. Early reports suggest the chipset has scored over 1.8 million points on AnTuTu benchmarks, showcasing its capability to compete with flagship processors such as Qualcomm’s Snapdragon 8 Gen 3.
Expected Price and Availability
MediaTek is positioning the Dimensity 8400 SoC as a premium mid-range solution, and it is expected to power smartphones starting at CNY 1,500 (approximately Rs. 17,250). The Redmi Turbo 4 is rumored to be the first handset to feature this new chipset, with a tentative launch in China in January 2025. Global markets may see the same device branded as the Poco X7.
Other devices like the Oppo Find X8S and Redmi K80E are also expected to be powered by the Dimensity 8400 SoC, expanding its reach across various flagship-killer and mid-tier segments.
Key Features to Rival Snapdragon 8 Gen 3
With its 4nm architecture, advanced GPU, and high benchmark scores, the Dimensity 8400 SoC is set to challenge Qualcomm’s Snapdragon 8 Gen 3 in terms of efficiency, performance, and affordability. This makes the chipset a strong contender for 2025’s most sought-after processors in the mid-to-premium smartphone category.
