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MediaTek Launches Dimensity 8400 Chipset: Boosting Multi-Core Performance and AI Capabilities for Premium Smartphones

MediaTek Launches Dimensity 8400 Chipset: Boosting Multi-Core Performance and AI Capabilities for Premium Smartphones

MediaTek has unveiled its latest Dimensity 8400 chipset, designed to elevate the performance of mobile devices in the premium smartphone segment. This powerful processor promises an impressive 41% improvement in multi-core performance over its predecessor, the Dimensity 8300, making it a game-changer for high-end smartphones.

Equipped with an all-new Neural Processing Unit (NPU), the Dimensity 8400 enhances AI capabilities, enabling lightning-fast generative AI tasks. It is also integrated with the Dimensity Agentic AI Engine (DAE), which converts traditional AI applications into more sophisticated agentic AI solutions. This chip delivers up to 21% faster outputs in Stable Diffusion v1.5 and a 33% increase in text-generation speed using China’s Baichuan 4B AI model.

Read more: MediaTek to Launch Next-Generation Dimensity 8400 SoC on December 23

The Dimensity 8400 chipset runs on eight Arm Cortex-A725 cores, offering a peak clock speed of 4.32GHz. Additionally, it ensures 44% better power efficiency with its precise power curve management, allowing users to experience premium performance without worrying about excessive power consumption. For enhanced graphics, the chipset features the Arm Mali-G720 GPU, providing 24% higher peak performance and 42% greater power efficiency compared to the previous generation.

MediaTek Dimensity 8400 now official with all big core CPU, a first for its segment

Smartphones powered by the Dimensity 8400 will be able to support up to LPDDR5x RAM and UFS 4.0 storage, ensuring faster data processing and improved app performance. This chipset also supports up to 320-megapixel camera sensors, bringing advanced imaging features with MediaTek Imagiq 1080 ISP, capable of faster focusing and better low-light performance.

When it comes to connectivity, the Dimensity 8400 chipset brings 5G-A modem support with speeds up to 5.17 Gbps and compatibility with Wi-Fi 6E and Bluetooth 5.4. The chip is also designed to work seamlessly with multiple satellite systems, including QZSS, Galileo, Beidou, GLONASS, NavIC, and GPS, ensuring precise navigation and location services.

Devices powered by the Dimensity 8400 will also deliver stunning visuals, with support for WQHD resolution and up to 144Hz refresh rates for smooth gaming and media playback. Furthermore, the chip’s MediaTek UltraSave 3.0+ technology enhances battery efficiency, ensuring users get the most out of their 5G experience.

Availability The MediaTek Dimensity 8400 chipset is expected to power Android devices by the end of 2024, with Xiaomi’s upcoming Redmi Turbo 4 in China set to be one of the first smartphones featuring this groundbreaking chip, anticipated to launch early next year.