Samsung is set to unveil its latest foldable smartphone, the Galaxy Z Flip 7, in July 2025, continuing its traditional foldable release schedule. According to a report by Korean media outlet Hankung, the Galaxy Z Flip 7 could become the first Samsung foldable phone to adopt a dual-chip strategy, featuring different chipsets depending on the region.
📱 Exynos 2500 for Korea, Snapdragon 8 Elite for the US
In a strategic move, Samsung is reportedly planning to equip the domestic (Korean) variant of the Galaxy Z Flip 7 with its own Exynos 2500 chipset, while the US and North American models are expected to feature Qualcomm’s Snapdragon 8 Elite SoC. This marks a significant shift from previous models like the Galaxy Z Flip 6 and Z Fold 6, which exclusively used the Snapdragon 8 Gen 3 Mobile Platform for Galaxy.
Read more: Samsung Galaxy A56 5G Faces Bootloop Issues After One UI 7 Update Featuring Gemini AI Assistant
⚙️ Benefits of the Dual-Chip Strategy
The Exynos 2500, said to be manufactured on an advanced 3nm process, may allow Samsung to offer better software and hardware synergy in its home market. Additionally, using its in-house chipset could enable the company to maintain more competitive pricing, especially in markets like South Korea and India.
Meanwhile, the Snapdragon 8 Elite, reportedly powering the Galaxy Z Fold 7 globally, will also be used in the Z Flip 7 for regions like the US, ensuring top-tier performance in premium markets.
🔋 Galaxy Z Flip 7 Expected Specifications
Leaked specifications suggest the Galaxy Z Flip 7 will feature a 3.6-inch cover display and a 6.8-inch inner foldable screen. The camera setup is rumored to include a 50MP primary sensor and a 12MP ultra-wide sensor. Powering the phone could be a 4,300mAh battery with 25W wired charging support, offering a solid upgrade over its predecessor.
🌍 Regional Differentiation Strategy
Samsung’s decision to use Exynos for Korea and Snapdragon for the US follows the brand’s past strategy in its Galaxy S series, where it used Exynos in India and other regions, and Snapdragon in North America. This return to a regional chipset split for foldables could set a new precedent in the industry.